Multilayer PCB recieve more than 2 conductive copper layers which mainly comprise of inner layer cores, prepreg layers and copper foils and they? lso are melted together through heat and strain. Lamination process is probably the key to handle top quality of multilayer PCB, this method requires specific heat and pressure regarding specific periods of time centered on materials utilized to ensure the PCB board is made properly.

The multilayer PCB is the development of the particular double sided PCB with increasing complexity and density associated with components, they allowed the designers in order to produce highly complex and compact circuits and further development of blind plus buried via opening technology has forced these limits actually further.

With the requirements of higher precision in a variety of programs, the demands of multilayer PCB maintain increasing continuously recently. The typical apps of multilayer published circuit boards consist of Computers, Data safe-keeping, Cell phone transmitting, GPS technology, satellite tv systems and therefore on.

A-TECH is usually an experienced multilayer PCB manufacturer which often own complete multilayer PCB manufacturing procedure in house through inner layer, vacuum lamination to area finishes, it gives us more positive aspects in the competitors of global marketplace shares for multilayer printed circuit panels on quality, cost and lead moment. multilayer pcb Currently the proportion of multilayer PCB we manufactured is more than 65%.

HDI PCB, the complete brand is Very dense Connect PCB, it takes very much higher wiring density with finer search for and spacing, smaller sized vias and increased connection pad density. Blind and hidden vias? design is 1 of their marked feature. HDI PCB are widely used for Cell phone, pill computer, digicam, GPS NAVIGATION, LCD module plus other different location.

A-TECH CIRCUITS gives HDI PCB production services to around the world customers in typically the top end automotive market, medical computer industry, mobile, computing in addition to defense industry.

At present the advanced HDI technology we used include: “Direct Laser Drill”(DLD) is going of copper coating by direct CARBON DIOXIDE laser irradiation, out-do additional laser going with conformal mask, the copper direct laser drilling is capable of providing increased accuracy, better opening quality and much better efficiency for HDI projects. “Copper Filled” for special bunch microvia, “Laser Immediate Imaging”(LDI) is especially designed for great line technology, to eliminate dimensional stableness problem of art work caused by environment and material issues.